Silkscreen-JK-SMD2920-500L PPTC Chip Resettable Fuse Selection

Name: Silkscreen-JK-SMD2920-500L PPTC Chip Resettable Fuse Selection
Brand: Dongguan Linkun Electronic Technology Co., Ltd.
SKU: JK-SMD2920
Price: 0.20 USD
Availability: InStock

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Silkscreen-JK-SMD2920-500L PPTC Chip Resettable Fuse Selection

Large Image : Silkscreen-JK-SMD2920-500L PPTC Chip Resettable Fuse Selection

Product Details:

Place of Origin:	China
Brand Name:	LINKUN
Certification:	RoHS
Model Number:	JK-SMD2920
Document:	Product Brochure PDF

Payment & Shipping Terms:

Minimum Order Quantity:	1000PCS
Price:	US $0.2 ~ 0.6 PCS
Packaging Details:	1000PCS/Bag
Delivery Time:	5-7 days
Payment Terms:	T/T, D/P, D/A, Western Union, MoneyGram
Supply Ability:	100,000 pieces/month

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Silkscreen-JK-SMD2920-500L PPTC Chip Resettable Fuse Selection

Description

Package::	SMD-2920	Rated Current::	1000mA
Rated Voltage AC::	24V	Rated Voltage DC::	24V
Fusing Capacity Recovery Type::	Self-recovery Type	Maximum Breaking Current::	65A
Fusing Characteristics::	Fast Type	Maximum Fusing Time::	Check The Specification
Dimensions::	Small	Fuse Material::	Silver-nickel Alloy
Cold Resistance (minimum)::	Check The Specification	After Fusing Resistance (maximum)::	Check The Specification
Operating Temperature Range::	-40~85℃	Fusing I²t::	0.1
Highlight:	PPTC Chip Resettable Fuse , 500L PPTC Chip Resettable Fuse , Silkscreen PPTC Chip Resettable Fuse

Surface Mountable PTC Resettable Fuse: JK-SMD1206 Series

Features:

RoHS Compliant ＆ Halogen Free
faster tripping, 2920 Dimension, Surface mountable, Solid state
Operation Current: 0.30A~3.00A
Maximum Voltage: 6V~60Vdc
Operating Temperature:-40℃TO 85℃

Product Dimensions

Terminal pad materials :Tin-Plated Nickle-copper

Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Unit :mm

Part Number	Marking	A		B		C		D	E
Part Number	Marking	Min	Max	Min	Max	Min	Max	Min	Min
JK-SMD030L	JK030L	6.73	7.98	4.80	5.44	0.60	1.15	0.30	0.15
JK-SMD050L	JK050L	6.73	7.98	4.80	5.44	0.60	1.15	0.30	0.15
JK-SMD075L	JK075L	6.73	7.98	4.80	5.44	0.60	1.15	0.30	0.15
JK-SMD075L-60	JK075L	6.73	7.98	4.80	5.44	0.60	1.30	0.30	0.15
JK-SMD100L	JK100L	6.73	7.98	4.80	5.44	0.60	1.00	0.30	0.15
JK-SMD100L-60	JK100L	6.73	7.98	4.80	5.44	0.70	1.50	0.30	0.15
JK-SMD125L	JK125L	6.73	7.98	4.80	5.44	0.50	1.00	0.30	0.15
JK-SMD150L	JK150L	6.73	7.98	4.80	5.44	0.50	1.20	0.30	0.15
JK-SMD185L	JK185L	6.73	7.98	4.80	5.44	0.60	1.20	0.30	0.15
JK-SMD200L	JK200L	6.73	7.98	4.80	5.44	0.40	0.80	0.30	0.15
JK-SMD200L-24	JK200L	6.73	7.98	4.80	5.44	0.60	1.20	0.30	0.15
JK-SMD250L	JK250L	6.73	7.98	4.80	5.44	0.40	0.80	0.30	0.15
JK-SMD250L-24	JK250L	6.73	7.98	4.80	5.44	0.50	1.20	0.30	0.15
JK-SMD260L	JK260L	6.73	7.98	4.80	5.44	0.40	0.80	0.30	0.15
JK-SMD260L-24	JK260L	6.73	7.98	4.80	5.44	0.40	1.20	0.30	0.15
JK-SMD300L-6	JK300L	6.73	7.98	4.80	5.44	0.40	0.80	0.30	0.15
JK-SMD300L-16	JK300L	6.73	7.98	4.80	5.44	0.60	1.20	0.30	0.15
JK-SMD300L-24	JK300L	6.73	7.98	4.80	5.44	0.60	1.20	0.30	0.15
JK-SMD400L	JK400L	6.73	7.98	4.80	5.44	0.40	1.00	0.30	0.15
JK-SMD400L-12	JK400L	6.73	7.98	4.80	5.44	0.50	1.20	0.30	0.15
JK-SMD400L-16	JK400L	6.73	7.98	4.80	5.44	0.60	1.20	0.30	0.15
JK-SMD500L	JK500L	6.73	7.98	4.80	5.44	0.70	1.50	0.30	0.15
JK-SMD500L-12	JK500L	6.73	7.98	4.80	5.44	0.70	1.50	0.30	0.15
JK-SMD500L-16	JK500L	6.73	7.98	4.80	5.44	0.70	1.50	0.30	0.15
JK-SMD600L	JK600L	6.73	7.98	4.80	5.44	0.70	1.50	0.30	0.15
JK-SMD600L-12	JK600L	6.73	7.98	4.80	5.44	0.70	1.80	0.30	0.15

Thermal Derating Chart-IH(A)

Part number	Maximum ambient operating temperatures(℃)
Part number	-40	-20	0	25	40	50	60	70	85
JK-SMD030L	0.44	0.37	0.35	0.30	0.28	0.23	0.20	0.16	0.10
JK-SMD050L	0.73	0.62	0.59	0.50	0.47	0.38	0.34	0.30	0.24
JK-SMD075L	1.09	0.92	0.88	0.75	0.70	0.56	0.50	0.45	0.36
JK-SMD075L-60	1.09	0.92	0.88	0.75	0.70	0.56	0.50	0.45	0.36
JK-SMD100L	1.45	1.23	1.17	1.00	0.93	0.75	0.67	0.60	0.48
JK-SMD100L-60	1.45	1.23	1.17	1.00	0.93	0.75	0.67	0.60	0.48
JK-SMD125L	1.81	1.54	1.46	1.25	1.16	0.94	0.84	0.75	0.60
JK-SMD150L	2.18	1.85	1.76	1.50	1.40	1.13	1.01	0.90	0.72
JK-SMD185L	2.68	2.28	2.16	1.85	1.72	1.39	1.24	1.11	0.89
JK-SMD200L	2.90	2.46	2.34	2.00	1.86	1.50	1.34	1.20	0.96
JK-SMD200L-24	2.90	2.46	2.34	2.00	1.86	1.50	1.34	1.20	0.96
JK-SMD200L-30	2.90	2.46	2.34	2.00	1.86	1.50	1.34	1.20	0.96
JK-SMD250L	3.63	3.08	2.93	2.50	2.33	1.88	1.68	1.50	1.20
JK-SMD250L-24	3.63	3.08	2.93	2.50	2.33	1.88	1.68	1.50	1.20
JK-SMD260L	3.77	3.20	3.04	2.60	2.42	1.95	1.74	1.56	1.25
JK-SMD300L-6	4.35	3.69	3.51	3.00	2.79	2.25	2.01	1.80	1.44
JK-SMD300L-16	4.35	3.69	3.51	3.00	2.79	2.25	2.01	1.80	1.44
JK-SMD300L-24	4.35	3.69	3.51	3.00	2.79	2.25	2.01	1.80	1.44
JK-SMD400L	5.8	4.92	4.68	4.00	3.72	3.00	2.68	2.4	1.92
JK-SMD400L-12/16	5.8	4.92	4.68	4.00	3.72	3.00	2.68	2.4	1.92
JK-SMD500L	7.25	6.15	5.85	5.00	4.65	3.75	3.35	3.0	2.4
JK-SMD500L-12	7.25	6.15	5.85	5.00	4.65	3.75	3.35	3.0	2.4
JK-SMD500L-16	7.25	6.15	5.85	5.00	4.65	3.75	3.35	3.0	2.4
JK-SMD600L	8.7	7.38	7.02	6.00	5.58	4.5	4.02	3.6	2.88
JK-SMD600L-12	8.7	7.38	7.02	6.00	5.58	4.5	4.02	3.6	2.88

Electrical Characteristic

Part Number	V_max	I_max	I_hold	I_trip	P_d	Maximum time to trip		Resistence
	(Vdc)	(A)	(A)	(A)	Max. (W)	Current	Time	Ri_min	R1_max
	(Vdc)	(A)	(A)	(A)	Max. (W)	(A)	(Sec)	(W)	(W)
SMD030L	60	100	0.30	0.60	1.5	1.5	3.0	0.60	4.80
SMD050L	60	100	0.50	1.00	1.5	2.5	4.0	0.18	1.40
SMD075L	33	100	0.75	1.50	1.5	8.0	0.3	0.10	1.00
SMD075L-60	60	40	0.75	1.50	1.5	8.0	0.3	0.10	1.00
SMD100L	33	100	1.00	2.20	1.5	8.0	0.5	0.065	0.41
SMD100L-60	60	100	1.00	2.20	1.5	8.0	0.5	0.065	0.41
SMD125L	33	100	1.25	2.50	1.5	8.0	2.0	0.05	0.25
SMD150L	33	100	1.50	3.00	1.5	8.0	2.0	0.035	0.23
SMD185L	33	100	1.85	3.70	1.5	8.0	2.5	0.030	0.15
SMD200L	16	100	2.00	4.00	1.5	8.0	4.5	0.020	0.12
SMD200L-24	24	100	2.00	4.00	1.5	8.0	4.5	0.020	0.12
SMD250L	16	100	2.50	5.00	1.5	8.0	16.0	0.020	0.085
SMD250L-24	24	40	2.50	5.00	1.5	8.0	16.0	0.020	0.090
SMD260L	16	100	2.60	5.20	1.5	8.0	10.0	0.014	0.075
SMD260L-24	24	100	2.60	5.20	1.5	8.0	18.0	0.014	0.075
SMD300L-6	6	100	3.00	6.00	1.5	8.0	20.0	0.012	0.048
SMD300L-16	16	100	3.00	6.00	1.5	8.0	20.0	0.012	0.048
SMD400L-12	12	40	4.00	8.00	1.5	20.0	4.0	0.010	0.040
SMD400L-16	16	40	4.00	8.00	1.5	20.0	4.0	0.008	0.040
SMD500L	8	100	5.00	10.00	1.5	25.0	5.0	0.005	0.031
SMD500L-12	12	40	5.00	10.00	1.5	25.0	5.0	0.005	0.031
SMD500L-16	16	40	5.00	10.00	1.5	25.0	5.0	0.005	0.031
SMD600L	6	40	6.00	12.00	1.5	25.0	6.0	0.004	0.020
SMD600L-12	12	40	6.00	12.00	1.5	25.0	6.0	0.004	0.02

Test Procedures And Requirements

Test	Test Conditions	Accept/Reject Criteria
Resistance	In still air @ 25℃	R_min≤R≤R_max
Time to Trip	Specified current,V_max,25℃	Tmaximum Time to Trip
Hold Current	30min,at I_H	No trip
Trip Cycle Life	Vmax,Imax,100cycles	No arcing or burning
Trip Endurance	Vmax,1 hours	No arcing or burning

Physical Characteristics and Environmental Specifications

Physical Characteristics

Terminal materials :	Tin-Plated Nickle-copper
Soldering zone	Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Environmental Specifications
Test	Conditions	Resistance Change
Passive aging	85℃,1000hours	±10%
Humidity aging	85℃/85%RH.100hours	±5%
Thermal shock	MIL-STD-202,Method 107G +85℃/-40℃,20times	±33% resistance change
Solvent Resistance	MIL-STD-202,Method 215	no change
Vibration	ML-STD-883C,Test Condition A	No chage

Electrical Specifications:

I_hold = Hold Current. Maximum current device will not trip in 25°C still air.

I_trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

V_max = Maximum operating voltage device can withstand without damage at rated current (Imax).

I_max = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Ri_min/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1_max = Maximum device resistance is measured one hour post reflow.

Recommended pad layout (mm)

Solder reflow conditions

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.

● Devices are not designed to be wave soldered to the bottom side of the board.

● Recommended maximum paste thickness is 0.25mm (0.010inch).

● Devices can be cleaned using standard industry methods and solvents.

● Soldering temprature profile meets RoHsleadfree process.

Notes: If reflow temperatures exceed the recommended profile, devices may not meet the

performance requirements

Tape Specification And Reel Dimensions

Coverning Specifications EIA 481-1(Unit:mm)
W	8.00± 0.10
P₀	4.0 ± 0.10
P₁	4.0± 0.10
P₂	2.0 ± 0.05
A₀	0.95 ± 0.10
B₀	1.85± 0.05
D₀	1.55± 0.05
F	3.50± 0.05
E₁	1.75 ± 0.10
T	0.20± 0.02
Leader min.	390
Trailer min.	160
Reel Dimensions
A		178±1.0
N		59±1
W₁		8.5+1.0/-0.2
W₂		12.0±1

Packaging Quantity

Part number	Quantity	Part number	Quantity
JK-SMD030L	2000	JK-SMD200L	2000
JK-SMD050L	2000	JK-SMD200L-24/ JK-SMD250L-24	1500
JK-SMD075L	2000	JK-SMD250L	2000
JK-SMD100L	2000	JK-SMD260L	2000
JK-SMD125L	2000	JK-SMD300L	2000
JK-SMD150L	2000	JK-SMD300L-16/ JK-SMD300L-24	1500
JK-SMD185L	1500	JK-SMD400L-12 /JK-SMD400L-16	1500
JK-SMD075L-60	2000	JK-SMD500L/JK-SMD500L-12/JK-SMD500L-16	1500
JK-SMD100L-60	1500	JK-SMD600L/JK-SMD600L-12	1500

Storage

The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present

WARNING

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods.

• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices.

Notes

The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit

production devices,However,users should imdependently evaluate and test the suitability of each product.JinRui makes on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,JinRui’s only obligations are those im the JinRui Standard Rerms and Conditions of Sale and in no case will JinRui be liable for any incidental,imdirect,or consequential damages arising from the sale,resale,ormisues of its products.Jinrui reserves the right to change of update,without notice,any information contained in this specification.

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Tel: 13423305709

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